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This chapter contains sections titled:
Introduction
Plasma Processing
Sticky vs. Roll‐off Superhydrophobic Surfaces
Local Wetting/Adhesion Control
Superamphiphobic/Superomniphobic Paper
Summary and Conclusions
Acknowledgments
This paper presents the first demonstration of a “zero-undercut” precision formation of ultrafine-line copper conductor patterns for redistribution layers (RDL) and thin film RF passives. This is accomplished by using a highly-anisotropic and uniform copper plasma-etching process to remove the seed layer with no lateral etching of the copper patterns, unlike what is seen with traditional seed-layer...
The creation of superhydrophobic surfaces that mimick lotus leaves is a relatively new research field that has attracted considerable attention. It shows promising applications in self-cleaning, microfluidics, bio-antifouling, and anticorrosion etc. Generally two requirements must be satisfied in order to achieve superhydrophobicity. First, the surface must be hydrophobic with a contact angle greater...
Carbon nanotubes (CNTs) have been proposed as electrical interconnects in microelectronic devices to address such problems as stress, electromigration, and heat removal. For electronic device and packaging applications, chemical vapor deposition (CVD) methods are particularly attractive due to characteristic CNT growth features such as selective spatial growth, large area deposition capability and...
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