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Cu/Epoxy is known as one of the weakest joint in the electronic packages. Due to the lack of adhesion, the copper and epoxy encapsulant interface is prone to delaminate, and failure will happen in electronic devices. To solve this problem, the thiol-based self-assembled molecular (SAM) treatment is introduced by our group. The benzene ring will give the hydrophobic characteristic to the surface up...
Two kinds of Nb3Sn CICC joints have been designed for the superconducting coils of the 40 T hybrid magnet. The “terminal joint” is for the joints between the terminals of the superconducting coils. The “interlayer joint” is for the joints between the layers of the coils. Both the terminal joint and the interlayer joint are fabricated before heat treatment. The interlayer joint is not processed any...
This paper focuses on the use of new hydrophobic thiol based molecular as adhesion promoter for copper-epoxy interfacial adhesion improvement. The motivation of this study is the long term interfacial adhesion reliability under moisture environment. In order to solve this problem, our group introduced the use of thiol-based molecules (SAM P) having hydrophobic characteristic as adhesion promoter through...
A solid tunable negative refractive index metamaterial is fabricated in a microstrip line using commercial available polycrystalline Yttrium Iron Garnet slabs and periodic copper wires. A clear tunable nonreciprocal 1 GHz wide passband that peaks at -10 dB is achieved near the negative refractive index region with a bias field of 3.4 kOe. Comparing with the previous tunable negative index metamaterial...
A novel waveguiding ferrite phase shifter utilizing negative refractive index metamaterial is demonstrated, which is the first device application of negative refractive index metamaterial of its kind. The negative index metamaterial is positioned at middle of the waveguide along the longitude direction, which is composed by a periodic copper wire pattern sandwiched by two pieces of high quality yttrium...
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