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The moisture migrating into underfill decreases the adhesion strength, swells to deform the assembly, and weakens underfill mechanical and thermal properties. In this study, interfacial reliability of FCOB exposed at 85 degC/85%RH was studied using Moire interferometry and mu-DiSC system developed. A thermal aging study was simultaneously performed to understand the time effect on long duration of...
We report on our efforts to develop a semiconductor based photonic bandgap device with MEMS features that is designed to reconfigure the photonic crystal structure into different types of waveguide devices such as switches, modulators, etc.
This article is concerned mainly with the software aspects of building reliable and efficient services on a cluster of workstations. A key technology to achieve such a goal is service replication. However, designing and implementing a replication system is a very difficult task. Based on an active replication model, this paper focuses on an object-oriented design pattern to simplify the design and...
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