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From the 1980s, the flip-chip technology has been successfully used for hybridization of Infrared Focal Plane Array (IRFPA), which leads to a high degree of homogeneity of the indium bumps and therefore very high interconnection efficiency. However, the severe application environment and the large array size bring great challenge to the interconnect reliability. Interconnect failure such as cracking...
This paper aims to identify lead users from an online user innovation community. Based on three dimensions of user characteristics — user activeness, community influence, and user relations, a Random Forest classification model for lead user identification is proposed. Using the data from the MIUI forum of Xiaomi community, this model is tested. The result shows that Random Forest classification based...
The frequency hopping radio has been widely used for its anti-interference ability. However, in the installation, testing and evaluation of short-wave frequency hopping radio, a realistic time-varying electromagnetic environment support is lacking. Hence, it is important to construct the time-varying electromagnetic environment which the short-wave frequency-hopping radio may face. To solve this problem,...
There exist numerous online data sources on the Web. It is desirable to facilitate end-users to build XML-based wrappers from the data sources for further composition and reuse. This paper describes Grubber, a tool that allows end-users to develop XML-based wrappers from these data sources with just a few mouse clicks and keystrokes. An active learning algorithm was proposed and implemented to reduce...
A photo-electron detection system with 32 PIN photodiodes in 1D array has been designed and implemented within 16cm width. There are mainly two parts in this system: the photodiode frontend with weak signal modulation and sampling, the signal processing backend with parallel signal processing and data transfer. The weak current signal of 32 PIN photodiodes' output is first amplified for about 104...
Robots often have limited knowledge and need to continuously acquire new knowledge and skills in order to collaborate with its human partners. To address this issue, this paper describes an approach which allows human partners to teach a robot (i.e., a robotic arm) new high-level actions through natural language instructions. In particular, built upon the traditional planning framework, we propose...
The integrated micro metal Dewar is an essential assembly in the infrared detector, and it is required more than ten years vacuum lifetime during application. In this paper, the critical effect factors and failure mechanisms on the vacuum lifetime were analyzed. Four groups of high temperature accelerated life test were introduced, according to the vacuum degradation mechanism, the end-of-life of...
We consider the problem of designing modulation codes for magnetic recording (MR) channels and other binary channels with ISI, where Markov sources are known to provide the best known lower bound on capacity. Our approach includes computing a costly channel matching a Markov source optimized for a given ISI channel. We then construct encoders and decoders for a modulation code matched to this costly...
Plastic encapsulated microcircuits (PEMs) are increasingly used in many rugged applications, but for their inherent reliability issues such as narrow temperature range, moisture sensitive, delamination and without screening. In this paper, the corresponding countermeasures are discussed, and five types of PEMs assessment practices including a series of measures of destructive physical analysis (DPA),...
The Integrated Detector Dewar Cryocooler Assembly (IDDCA) is a critical component for advanced infrared systems, and especially in infrared (IR) applications, a high reliability for the IDDCA is required increasingly. In this paper, we systematically analyze the failure modes of IDDCA, such as interconnect failure, diodes degradation, vacuum failure, spring fracture, leakage of working medium, mechanical...
Non-binary low-density parity-check (NB-LDPC) codes are robust to various channel impairments. In this paper, we present a new decoding algorithm for the NB-LDPC decoder that is based on the q-ary min-sum algorithm (QMSA). The new one modifies the check node (CN) computations of the QMSA into two steps. By reorganizing the message entries and providing the most likely symbol, a compressed intermediate...
A high resolution and high sensitivity camera was developed using back illuminated, frame transfer on-chip electron multiplying gain CCD(EMCCD) with 1024x1024 pixels named CCD201 from E2V technologies. The CCD timing generated by a CPLD affords the normal EMCCD diver timing via a vertical clock driver chip EL7156. A programmable control voltage power source is adopted for the electron multiplying...
Mechanical reliability of epoxy molding compounds in plastic packages of integrated circuits (IC) is greatly affected by the compound ability to absorb moisture. In this paper, the hygro-thermal effect of a 2-layer stacked die package was investigated which emphasized on the hygroscopic stress and thermal mismatch stress. By finite element analysis (FEA), the distribution of moisture diffusion, thermo-mechanical...
Moisture penetrating into the polymer and subsequent hygroswelling stress play an important role in the integrity and reliability of plastic electronic packages. In this paper, moisture absorption experiments of four types of plastic encapsulated microcircuits (PEMs) were conducted. Moisture diffusion characteristics of PEMs available by experiments were measured and typical moisture diffusion characteristics...
Firstly, the paper introduces the principle and basic architectural scheme of the high-speed framing gated camera. Then, elaborates the hardware design and realization for the four-channel synchronous image data acquisition. After that, the functions and the development of the control software are discussed in detail. Some critical problems and the solutions, such as the multi-channel data synchronous...
Package on Package (PoP) is a packaging technology that one package is placed on top of another package to integrate different functionalities while still maintain same foot print size. The advantages of PoP are evident, but there are also some challenges with respect to packaging and Surface Mounting Technology (SMT). Due to the complex architecture of PoP, some reliability issues have been raised,...
The maximum avalanche energy that the power MOSFET devices can sustain is primarily determined by the device design and manufacturing process. However, the layout of the thick Al wires on the source pad of the chip also has some influences on it. In this research, two different MOSFETs (400V/5.5A; 75V/75A) were chosen and two or three Al wires were bonded with different layouts to investigate the...
To be used in the research of radiation effect and reinforce of radiation resistance for CCD, a camera based on a linear CCD chip—TH7814A is designed by us, which should exactly reflect sensitization of the CCD pixels in real time. In this paper, the basic architecture scheme of the linear CCD camera system is introduced, and the remote and real-time data acquisition based on CPLD, USB, and optic...
In this paper, finite element analysis (FEA) was used to evaluate the stress distribution on quad flat no-lead (QFN) packages. Different models were established, including moisture diffusion, thermo-mechanical stress, hygro-mechanical stress and hygro-thermo-mechanical stress models. The transient moisture absorption and desorption analysis were performed to estimate the package moisture distribution...
Through the research and the application of the information interactive technology between the power supply company and the big customers, it is possible to realize the power utilization automation of the customers, thus the power supply company can apply the failure positioning, the power utility management and the monitoring to the power supply terminal, and therefore, meet the various requirements...
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