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Impact of advanced technologies on the design and structure of multicore architectures is presented in this paper. More specifically, the power consumption and design complexity walls are examined leading to a “conquer-and- divide” strategy based on multicore partitioning and specialization. We then show how 3D stacking, Monolithic 3D integration and BEOL NVM can be associated to build new, simplified...
In this paper, we present a high density 4T SRAM bitcell designed with 3D sequential CoolCube™ technology based on FD-SOI transistors in 14nm node. An in-house SPICE characterization testbench is used to optimize the critical operations (read and hold) of a 4T SRAM bitcell through post layout simulations. Results show that the proposed 3D 4T Bitcell offers 30% footprint reduction compared to the planar...
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