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An innovative process to realize 3D packages with controlled Si-power semiconductor devices has been developed. We purpose, for the first time and based on a low-cost process, to make compatible the silver sintering process with aluminum top-metallization dice. The use of a silver epoxy resin allows to process the top metallization of silicon dice. Shear tests on diodes have demonstrated the good...
In this paper, diodes manufactured in 2008, allowing to obtain the first electrical measurements of the Deep Trench Termination (DT2), are analyzed in a reliability purpose. For the first time, assemblies are made using DT2 diodes reported on Direct Bonded Copper (DBC) substrates using silver sintering process in order to confirm the possibility to integrate this technology in future lead-free packaging...
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