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In this research, a series of epoxy resin modified with organosilicone intermediate RSN-6018 (RE) were prepared through a condensation reaction between the COH of bisphenol-A type epoxy resin and the SiOH of organosilicon intermediate. These resins, having solid content up to 80wt.%, could be cured at room temperature by a polyamide curing agent to yield transparent coatings. Chemical structures of...
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