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As the requirement of portable and smart devices rapidly increasing, applications of high performance 3D integration and M/NEMS packaging have enormous market potential. High speed in-line testing is a critical bottleneck for 3D SiP and TSV processes. In this paper, we promote a method of in-line testing for interconnection performance of TSV structures, and a novel 3D CPW model for performance testing...
In this paper, the potential application of combining cylindrical TSV and annular TSV into 3D integration was studied. First, the schematic fabrication process of cylindrical and annular TSV was proposed. Lumped equivalent circuit model of these different kinds of TSV structures from the physical configuration were studied and verified. Besides, 3D full wave electromagnetic (EM) simulations of cylindrical...
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