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There has been an increasingly interest in the use of paper as inexpensive, foldable and disposable substrate material. In this paper, a novel pencil-on-paper strain sensor for flexible vertical interconnection is proposed. Graphite traces were used to fabricate the device. The strain changes would result in resistance changes depending on the graphite particles movement, thus, rotation strain can...
Nowadays, wafer bonding is becoming a key enabling technology for three-dimensional (3D) packaging, micro-electro-mechanical systems (MEMS) encapsulation and heterogeneous integration. This paper develops and investigates entire Si wafer bonding based on thin Al and Sn films. 500 nm-thick Al and 500 nm-thick Sn films are sputtered onto silicon wafers. At bonding temperature of 280 °C, the average...
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