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Thermal stress is an influential factor for the reliability of HPDL and their optical properties. Two packages of conduction-cooled-packaged 60W HPDL were selected as the study samples. In order to investigate what reflow factors influence thermo-mechanical of HPLD, a COS model is established. In reflow process and working process, hard solder package suffers higher thermal stress. Thermal stress...
With the improvement of performance and reliability, high power semiconductor lasers have been widely applied in more and more fields. Thermal management is one of the most important issues effecting the optical-electrical performance of high power semiconductor laser. Compared with liquid-cooled techniques, conduction-cooled techniques have many advantages in some special applications because it...
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