The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Local apparent strength of interface between copper and cap layer on top was diverse depending on the crystal orientation underneath. For a comprehension of this diversity, physical adhesion energy to separate the interface was evaluated. It essentially does not include mechanical energy dissipating in plastic deformation in the process of crack extension. Sub-micron scale torsion test for elastic-plastic...
As vacuum attracts attention from a viewpoint of high insulation performance and environmental-friendliness, vacuum circuit breakers (VCBs) are expected to develop into higher voltage level. In this paper, we discuss the relations between the surface state and the conditioning mechanism of Cu-Cr electrode during impulse voltage application process in vacuum. The experimental results showed that the...
As the stress coupling in organic Flip Chip packages become more critical due to the introduction of brittle materials and continued pitch shrink, various technologies are emerging to manage or reduce thermal mismatch stresses. In this regard pillar bumps on the die side have had a good start as they also address underfill flow at shrunk pitch as well as electromigration during operation. Pillar bumps...
Chemical vapor deposition of MnOx (CVD-MnOx) was performed on blanket substrates as well as patterned interconnect structures. A conformal layer of MnOx was formed by the MnOx on SiO2 within a contact hole with a uniform thickness of 3 to 4 nm. Excellent diffusion barrier property was obtained after annealing at 400 degC. In contrast, the CVD-MnOx on Cu formed solid solution with Cu. The solute Mn...
AC losses consist of both regular losses that are proportional to cable twisting pitch squared and irregular losses that could not be estimated from short conductor sample test results. It was explained from our previous works that irregular loops in conductor which are caused by asymmetric strand positions as a result of low void fraction of CIC conductor, produce the losses with long time constants...
The electromigration (EM) performance of dual damascene Cu lines has been investigated correlated with quality of Cu lines. The results on the EM test showed that the EM lifetime decreases as the linewidths decrease. Failure analysis after EM test revealed that EM properties of damascene Cu lines are dominated by the transport of Cu atoms along an interface between a Cu line and a barrier layer. It...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.