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Polyimide (PI)/graphene sheets (GSs) composites were prepared by solution blending. The incorporation of GSs into PI increased the thermal conductivity, thermal stability and mechanical properties of PI. The thermal conductivity of PI/GSs composites was significantly improved compared with that of neat PI from 0.254 to 1.002 W/mK; this can be attributed to the homogeneous dispersion of graphene and...
In this report, we demonstrate that the thermal conductivity, glass transition temperature, thermal stability and dynamical mechanical properties of epoxy composites could all be improved by incorporating hyperbranched aromatic polyamide grafted silicon carbide (SiC-HBP) whiskers, using a solution method. The morphology and thermal properties of these newly modified epoxy composites were systematically...
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