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In this paper, the package solutions for die-to-die interconnection including fine-line substrate and ASE advance wafer level package (aWLP) have been purposed. The fin-line substrate has 3um trace width and 3um trace space on top layer with copper interconnection. For aWLP, the trace width and space of interconnection on redistribution layer (RDL) is the same with fine-line substrate. The different...
As clock speeds increase into the gigahertz regime and rise times decrease into the pico-second regime, the interaction between capacitors and power/ground planes of a package, or board on which they are mounted becomes vitally important to the performance of a power delivery system. Capacitors pose the biggest challenge for integration in packages due to the large capacitance required for decoupling...
The effect of the number of the shorting vias on the power integrity of multi-layered structures has been demonstrated in this paper. Following that, an empirical design rule for the fewest number of the shorting vias is proposed to maintain the original power integrity and reduce the cost at the same time. For validation, the design concept is also realized in a real package structure at last.
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