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Recently, sustained power oscillation at subsynchronous frequency was captured in direct-drive permanent magnetic synchronous generator (PMSG) based wind farms in Xinjiang Uygur Autonomous Region, China. This new type of subsynchronous interaction (SSI) detected in practical systems has never been reported and analyzed before. Therefore, its mechanism and characteristics are not yet clearly clarified...
In this paper, we design a novel knee exoskeleton. The designed exoskeleton has a 1 DOF with knee joint actuated in the sagittal plane. The exoskeleton is actuated base on Series Elastic Actuator (SEA) instead of traditonal stiff actuator. SEA is a compliant actuator, having the advantages of low output impedance, low friction, high quality force control and backdrivability. Thanks to these nice characteristics,...
In the mobile phone market-driven trend, mobile phones are equipped with high definition display, low power consumption, and a thin and light body. As mobile phone body thickness keeps decreasing, many components should follow the trend, including display panel module, covering panel glass, phone case, battery, camera module, PCB, IC package…etc. In this paper, the fan-out wafer level package (FOWLP)...
This paper present a method to estimate the output current or voltage in the primary-side of a two-transmitter inductive wireless power transfer system, which has been introduced to achieve the continuity of power transfer, without any direct measurement on the receiver coil and load conditions. The proposal can ensure the continuity and stability of charging in dynamic wireless power transfer system...
This paper presents the electrical characterization for fine lines on organic substrate using TDR. Micro-strip line (MSL) and grounded coplanar waveguide (GCPW) two structures are studied and fabricated. Impedance between 1GHz and lossless is about 10 ohms gap for both structures. This changes the impedance matching design concept because conduction loss of fine lines can't be ignored as conventional...
Recently, data transmission volumes of internet networks have grown explosively because most of consumer devices, such as smartphones, tablets, wearable devices, etc., all employ the same media. In the future, IoT will be applied to connect various devices related to human life. Thus, high data rate networking technology development becomes a very important task for Big Data transmission, which includes...
In this paper, the performance of GSG co-planar waveguide (CPW) type transmission line on silicon interposer and stacking memories by through-silicon-vias (TSVs) are analyzed. The high conductor loss of fine lines will cause the impedance varying with frequency and make the reflection loss minor. Furthermore the flat attenuation of such fine line will result in low distortion waveforms and have better...
This paper presents the electrical characterization of fine line design. For this kind of very thin and narrow fine lines in high density substrate, the trace is no longer lossless or low-loss transmission line and the characteristic impedance is also varying with frequency. This phenomenon on high density substrate will lead to different design guideline from conventional one. In this paper, the...
Power Integrity (PI) is an important topic in today's high-speed interface designs, and the power distribution network (PDN) is a major factor in the package design. This research we propose an effective design method for a multi-layer and complex package design. The first section of this paper is to perform the current density to fast find the bottleneck of draft design for the DDR core power and...
The tolerance of dielectric constant between raw material before the substrate production and real sample after the process variation is the kernel of this project. In the past, the electrical data sheet of dielectric material always comes from the suppliers. However, material suppliers do not consider the effect of substrate manufacture but only implement the measurement through raw materials. Therefore,...
In this paper, the package solutions for die-to-die interconnection including fine-line substrate and ASE advance wafer level package (aWLP) have been purposed. The fin-line substrate has 3um trace width and 3um trace space on top layer with copper interconnection. For aWLP, the trace width and space of interconnection on redistribution layer (RDL) is the same with fine-line substrate. The different...
Serial data (SerDes) link has been widely used in gigabit rate link, storage applications, telecom, data communications, etc. The ability to accurately predict SerDdes channel insertion loss and return loss plays a critical role in prediction of SerDes link performance. Two test vehicles are designed to demonstrate the step-by-step modeling technique. One is the bare package sample, and the other...
A composite radome with wideband transparent and absorbing properties is proposed in this paper. The composite unit of this radome is a multilayer structure combining metallic and resisitive components. The unit is studied thoroughly. Under the TE and TM incident waves' illumination separately from different directions, its transmission/reflection coefficients are obtained. The radome-antenna configuration...
A modified λ /4 stepped impedance resonator (SIR) is proposed, in which a shunt open stub is loaded between the low impedance line and high impedance line of a conventional λ /4 SIR. Based on this modified λ/4 SIR a compact dual-band bandpass filter (BPF) with high selectivity is presented. Two transmission zeros (TZs) are generated near each passband for high selectivity. To demonstrate this method,...
In this paper, an open-stub compesation technique is proposed for passive equalizers used in high-speed digital communication systems. By simply lumping an open-stub to the conventional RL-type passive equalizer, the frequency-dependent channel loss from the long transmission path can be compensated, the frequency response of the channel becomes more flat and the bandwidth is wider. Compared proposed...
A modified λ /4 stepped impedance resonator (SIR) is proposed, in which a shunt open stub is loaded between the low impedance line and high impedance line of a conventional λ /4 SIR. Based on this modified λ/4 SIR a compact dual-band bandpass filter (BPF) with high selectivity is presented. Two transmission zeros (TZs) are generated near each passband for high selectivity. To demonstrate this method,...
In this paper, an open-stub compesation technique is proposed for passive equalizers used in high-speed digital communication systems. By simply lumping an open-stub to the conventional RL-type passive equalizer, the frequency-dependent channel loss from the long transmission path can be compensated, the frequency response of the channel becomes more flat and the bandwidth is wider. Compared proposed...
In this paper, we propose an open-stub compensation technique for passive equalizers used in high-speed digital communication systems. By simply lumping an open-stub to the conventional RL-type passive equalizer, the frequency-dependent channel loss from the long transmission path can be compensated, the frequency response of the channel becomes more flat and the bandwidth is wider. Compared proposed...
This paper describes the progressions for power and signal integrity issues on quad flat non-lead (QFN) package. A novel decoupling capacitor is achieved by modifying the footprint of QFN package. The modified footprint is connected to printed circuit board (PCB) power plane and coated the solder mask above. A large decoupling capacitor between power and ground is achieved by thin film solder mask...
As clock speeds increase into the gigahertz regime and rise times decrease into the pico-second regime, the interaction between capacitors and power/ground planes of a package, or board on which they are mounted becomes vitally important to the performance of a power delivery system. Capacitors pose the biggest challenge for integration in packages due to the large capacitance required for decoupling...
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