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This paper compares the characteristics of serial, parallel and LCC compensation topologies of secondary-side in wireless powering systems with a constant-current primary-side. The topologies characteristics of power, efficiency and load are carefully analyzed and detailed presented. And the correctness of theoretical analysis is verified by simulations. This study results can guide the selection...
The use of nonlinear power electronic loads and new energy power generations make harmonic injection to the grid inevitable, lead to transmission line more additional harmonic losses and significant economic losses. Based on the mechanism of harmonic losses, this paper derived current density distribution formula for transmission line, a more precise calculation method of each harmonic resistance...
A high efficient CMOS class-E power amplifier (PA) by using Quad Flat No-leads (QFN) package combined with Through Silicon Via (TSV) grounding is presented. TSV has much smaller parasitic inductance and resistance than wire-bonds. TSV technology can improve PA efficiency, reduce die size samples and retain low cost in QFN package. The TSV samples are made and measured by using double-side probing...
Power Integrity (PI) is an important topic in today's high-speed interface designs, and the power distribution network (PDN) is a major factor in the package design. This research we propose an effective design method for a multi-layer and complex package design. The first section of this paper is to perform the current density to fast find the bottleneck of draft design for the DDR core power and...
In this paper, the package solutions for die-to-die interconnection including fine-line substrate and ASE advance wafer level package (aWLP) have been purposed. The fin-line substrate has 3um trace width and 3um trace space on top layer with copper interconnection. For aWLP, the trace width and space of interconnection on redistribution layer (RDL) is the same with fine-line substrate. The different...
A theoretical model of thermoelectric device was proposed that uses automobile exhaust gas for power generation. According to the principal of Fourier's law of heat conduction and the Peltier effect, a thermodynamics analysis was conducted in which expressions for calculating the output power and the efficiency were derived. Some influencing factors, such as the temperature distribution of the TEG...
The traveling state of submarine in water includes deep in water and near water-surface. Compared with the deep water submerged body, the flow field around a moving submerged body near the free surface is more complex, submerged body will suffer from wave-resistance. Uses ANSYS-ICEM software to build submarine model and computes it with CFX software. The resistance and wave pattern of a submarine...
Traditional IC scaling is becoming increasingly difficult at the 22 nm node and beyond. Dealing with these challenges increase product development cycle time. For continued CMOS scaling, it is essential to start design explorations in new process nodes as early as possible. Such an effort requires having Predictive Technology Models, which bridge technological and design practices, in order to assess...
An electrical resistance tomography sensor consists of a set of measurement electrodes. In general, finite element method (FEM) is used to solve the forward problem (i.e. calculate the resistance value for a given conductivity distribution and electrodes setup). In this paper, a new approach is proposed. The equivalent resistor network model of an electrical resistance tomography (ERT) sensor has...
Ground water level measurements are very important for a wide range of applications in geosciences, agriculture, environment monitoring and mining industry. Currently, reliable and automatic ground water level measurements have not been realized. This paper presents the simulation and design of a segmented resistance sensor for measuring ground water level. Based on this sensor design, we have developed...
The high performance window-BGA for a high speed Synchronous Dynamic Random Access Memory (SDRAM) has been designed. In this paper, power distribution system (PDS) design on IC package is discussed and studied. A appropriate PDS design will provide not only the stable power supply but also the superior current return path for signal channels. The simulation approach will cover complete Signal Integrity...
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