The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
With merits like high I/O density, superior electrical and thermal performance, and small form factor, flip chip has become more and more widely used in electronic packages. Although the flip chip packaging process has been fairly improved, the conventional CUF (Capillary Underfill) process is a bottleneck that results in lower productivity and higher cost. MUF (Molded Underfill) process offers an...
Wafer bumping is a key process for flip chip packaging. There are several bumping techniques such as ball drop, electroplating and stencil printing, in which stencil printing is thought to be an economical choice because it is compatible with conventional SMT technology. However, when bump pitch is less than 100 μm, it becomes more difficult to control the deposition volume of the solder paste. In...
Wafer bumping is a key process for flip chip packaging. There are several bumping techniques such as ball drop, electroplating and stencil printing, in which stencil printing is thought to be an economical choice because it is compatible with conventional SMT technology. However, when bump pitch is less than 100 μm, it becomes more difficult to control the deposition volume of the solder paste. In...
With merits like high I/O density, superior electrical and thermal performance, and small form factor, flip chip has become more and more widely used in electronic packages. Although the flip chip packaging process has been fairly improved, the conventional CUF (Capillary Underfill) process is a bottleneck that results in lower productivity and higher cost. MUF (Molded Underfill) process offers an...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.