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MIS (Molded Interconnect System) substrate, as a type of coreless substrate, has the advantages of lower profile and higher electrical performance. However, warpage would be one of the major concern without the mechanical support of the core material. In this study, warpage of multilayered MIS substrate has been simulated using finite element analysis (FEA). Coefficients of thermal expansion (CTE)...
Pd-coated copper wire bonding is getting more practical applications in electronic packaging because of advantages, such as ease of use, better bonding performance and reliability. ENEPIG (Electroless Ni Electroless Pd Immersion Au) is a prevalent surface finish technique that can realize more flexible substrate design, increase wire density and hence achieve device miniaturization. Study had been...
Increases in network traffic due to the expansion of IP broadcast services in recent years have stimulated the requirement of performance and capability in transport network. As an attractive candidate to support the packet switching functionality envisioned in converged next generation transport systems, T-MPLS is gained more attentions to find out its characteristics. This paper describes a T-MPLS...
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