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This paper introduces the Gatekeepers Study, a three-year project with the goal of examining variation in enrollment in postsecondary engineering programs for students from Virginia high schools. Our research takes a macroscopic, systemic view of an entire state's high school-to-postsecondary engineering pathway to understand how each high school performs in terms of having its students from underrepresented...
Cu is commonly used as filling material for TSV in 3D integration [1]. However, there is a problem of thermal mismatch between Cu and Si, and also there is still space for improvement in electrical resistivity. In order to improve the physical properties of TSV electroplating copper, we added high conductivity and low expansion coefficient nanoparticles such as graphene to the copper plating solution...
New forms of complex systems with novel working patterns are emerging in contrast to our ignorance, to some degree, of their internal functioning mechanism. Research should be conducted to make better understandings of these complexity problems. In this paper, we proposed a method to study into the system complexity and to cope with it by controlling the system interactions and couplings based on...
Due to the widespread deployment and low cost, WiFi has become one of the most attractive research fields in indoor environments, for example, almost every smart mobile device can be a WiFi signal receiver and transmitter. Various WiFi based indoor localization approaches have been proposed under different circumstances. However, most of them are only suitable for relatively small indoor environments,...
Modern software systems are becoming increasingly complex, relying on a lot of third-party library support. Library behaviors are hence an integral part of software behaviors. Analyzing them is as important as analyzing the software itself. However, analyzing libraries is highly challenging due to the lack of source code, implementation in different languages, and complex optimizations. We observe...
Software defect prediction, which predicts defective code regions, can help developers find bugs and prioritize their testing efforts. To build accurate prediction models, previous studies focus on manually designing features that encode the characteristics of programs and exploring different machine learning algorithms. Existing traditional features often fail to capture the semantic differences...
To improve software reliability, many rule-based techniques have been proposed to infer programming rules and detect violations of these rules as bugs. These rule-based approaches often rely on the highly frequent appearances of certain patterns in a project to infer rules. It is known that if a pattern does not appear frequently enough, rules are not learned, thus missing many bugs. In this paper,...
A novel low temperature wafer-level Cu-Cu bonding method using Ag nanoparticles (NP) was proposed and realized in this paper. A bonding structure consisted of Cu bonding pads, TiW barrier/adhesive layer was firstly fabricated on the silicon wafer. Ag NPs were then deposited by physical vapor deposition (PVD) on Cu pads. The morphology of Ag NPs annealed at different temperature was studied. Bonding...
MIS (Molded Interconnect System) substrate, as a type of coreless substrate, has the advantages of lower profile and higher electrical performance. However, warpage would be one of the major concern without the mechanical support of the core material. In this study, warpage of multilayered MIS substrate has been simulated using finite element analysis (FEA). Coefficients of thermal expansion (CTE)...
Ultrasound imaging procedures are deemed as one of the most convenient and least invasive medical diagnostic imaging modalities and have been widely utilized in health care providers, which are expecting semiautomatic or fully-automatic imaging systems to reduce the current clinical workloads. This paper presents a portable and wearable soft robotic system which has been designed with the purpose...
Energy storage systems have been widely applied in power distribution sectors as well as in renewable energy sources to ensure uninterruptible power supply. This paper proposes a modified model predictive control (MMPC) method based on the Lyapunov function to improve the performance of a bidirectional ac–dc converter, which is used in an energy storage system for bidirectional power transfer between...
Ultrasound imaging is deemed as one of the least harmful noninvasive imaging techniques in the current commonly used medical procedures. The machine operates with four-separated soft pneumatic actuator and the system can be mounted onto the body through suction plates. Vacuum suction force is introduced on the body surface to attach the soft robotic system onto the intended location. The feasibility...
In order to lower Cu-Cu bonding temperature and shorten bonding time applied for 3D integration, nanostructure has been introduced on bonding Cu surface. However, few studies have been reported on Nano Particles (NPs) formation by film deposition process such as pulsed laser deposition (PLD), which would be compatible with CMOS process. In this work Ag nanostructure containing strings of NPs was formed...
In this paper, wafer level room temperature ultrafine pitch Cu-Cu direct bonding was accomplished followed by annealing process at the temperature of 300 °C for 30 min. Cu pad pitches of 15μm, 20μm and 25μm with different pad size of 2μm, 3μm and 4μm were designed and fabricated on 300mm wafers. Additionally, Cu pad pitch of 6μm, 7μm, 8μm with Cu pad size of 3μm was also designed on the wafer by considering...
This paper presents the design of a 200-V, 6.7-kW, 20-kHz inductive power transfer circuit for electric vehicles based on the SAE J-1773 level-2 battery charger requirement. The proposed inductive power transfer (IPT) circuit has series-series capacitor compensation. This paper shows the design of the capacitor compensation and analyzes the effects of the different topologies of capacitor compensation...
Thermomechanical reliability performance of solder bumps is a critical issue in flip chip package. Traditional underfilling process in flip chip packaging applied capillary principle to make underfill material flow into the gap between die and substrate, it was called CUF (Capillary Underfill) process. In recent years, a low cost solution called MUF (Molded Underfill) process becomes a substitution...
Bipolar transistor is widely applied in the field of power electronics. However, there still exist many difficulties to manufacture high voltage Bipolar transistor nowadays. One of the approaches that can improve the withstand voltage of the Bipolar transistor is to stack multiple low-withstand voltage bipolar chips. SiC Schottky diode is bipolar transistor with aluminum electrode as anode and silver...
Many defect prediction techniques are proposed to improve software reliability. Change classification predicts defects at the change level, where a change is the modifications to one file in a commit. In this paper, we conduct the first study of applying change classification in practice. We identify two issues in the prediction process, both of which contribute to the low prediction performance....
Many techniques have been proposed to automatically recover software architectures from software implementations. A thorough comparison among the recovery techniques is needed to understand their effectiveness and applicability. This study improves on previous studies in two ways. First, we study the impact of leveraging more accurate symbol dependencies on the accuracy of architecture recovery techniques...
We propose and implement a new approach, Document-Assisted Symbolic Execution (DASE), to improve automated test generation and bug detection. DASE leverages natural language processing techniques and heuristics to analyze program documentation to extract input constraints automatically. DASE then uses the input constraints to guide symbolic execution to focus on inputs that are semantically more important...
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