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A study of different methods for cleaning copper components to improve electrical conductivity of Cu/Ag glue joints is presented. Copper samples were cleaned with three different methods: (i) wet chemical cleaning with tetrachloroethylene, (ii) discharge cleaning with an oxygen plasma, and (iii) subsequent discharge cleaning with oxygen and hydrogen plasmas. Discharge cleaning was performed in a low-pressure...
The recombination coefficient for the reaction O+O->O 2 on a polycrystalline niobium surface was measured at various experimental conditions. The source of O atoms was a low pressure weakly ionized highly dissociated oxygen plasma created in a RF discharge. The electron temperature in plasma was about 5eV and the density of positive ions between 5 and 10x10 15 m -3...
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