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In this paper, a failure analysis on ball grid array (BGA) solder joints is revealed with the aid of scanning acoustic microscope (SAM), optical microscope (OM), scanning electron microscope (SEM) and strain tester. By employing both the nondestructive analysis and destructive analysis, it was found that crack of several BGA solder joints caused the failure of the printed circuit board assembly (PCBA)...
Due to the promotion of the globalization of environmental protection process, some high reliability requirements of electronic products have to be passive to the backward compatible soldering process. Compared to the traditional Sn-Pb soldering process and the current mature Pb-free soldering process, the backward compatible soldering process is faced with a smaller process window and a higher process...
With the decrease in the overall size and the rapid increase in the working frequencies of printed circuit boards, the reliability of solder joints, especially the high frequency signal transmission reliability has become the key factor in system reliability. In this paper, changes in RF impedance of solder joints in a temperature cycling environment was studied using time-domain reflectometry measurements...
Electronic devices and solder joints inside the devices are always exposed to thermal loads, which would change the microstructure of solder joints. It is well known that the growth of the intermetallic compound between bulk solder and substrate and the change of the structure in bulk solder itself might lead to fatigue crack of solder joints. The objective of this study is to demonstrate the change...
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