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Through Silicon Via (TSV) technology represents one key aspect of 3D integration. International Technology Roadmap for Semiconductors (ITRS) has identified a need for an in-line metrology for characterizing voids in TSV structures. We have previously described a laser-based acoustic technique which can be used to detect voids in vias. Results for 10×100 and 5×50μm via structures were reported. In...
This paper studies acoustic emission from hydraulic fracturing using DFB fiber laser sensors interrogated by a 3×3 coupler. This study shows that fiber lasers are useful tools to monitor fracturing processes for oil gas extraction.
This paper considers the vehicle navigation problem for an autonomous underwater vehicle (AUV) with six degrees of freedom. We approach this problem using an error state formulation of the Kalman filter. Integration of the vehicle's high-rate inertial measurement unit's (IMU's) accelerometers and gyros allow time propagation while other sensors provide measurement corrections. The low-rate aiding...
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