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Thermosonic flip chip bonding is used in certain fine pitch IC packaging for its unique features. By using this bonding process in this paper, 1 mm times 1 mm chip with 8 gold bumps has been bonded onto a silver-coated substrate. Dynamical properties of transducer system, which is the key component for providing the ultrasonic energy, have been investigated using finite element model (FEM) and measurement...
Thermosonic flip chip bonding has been widely used in fine pitch IC packaging for its unique features. By using thermosonic flip chip bonding at an aluminum wire bonder, 1 mm*1 mm chip with 8 gold bumps is bonded successfully to Ag substrate, and the bonding strength reaches as high as about 30gf/bump. Dynamical characteristics of ultrasonic transducer are investigated by finite element method and...
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