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Copper (Cu)-containing bioactive glasses (BGs) are attracting attention for bone regeneration and wound healing since they have bone-bonding capability and potential osteogenesis and angiogenesis properties. In this study, highly dispersed and spherical Cu-containing bioactive glass nanoparticles (Cu-BGNs) were successfully synthesized via a modified Stöber method. The content of incorporated Cu in...
Through silicon via is an essential element for three dimension integration. Excessive stress have potential effects on the reliability of the structure. One concern is the peeling problem of SiO2 layer. It was found that it is caused by the electroplated copper during later solder reflow process. We also found that it is possible to ameliorate the peeling problem by increasing the compressive stress...
Through silicon via is an essential element for three dimension integration. Excessive stress have potential effects on the reliability of the structure. One concern is the peeling problem of SiO2 layer. It was found that it is caused by the electroplated copper during later solder reflow process. We also found that it is possible to ameliorate the peeling problem by increasing the compressive stress...
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