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Electroplating of copper is widely used for the fabrication of interconnections of printed circuit boards, in which via-holes are used to connect conductive layers. Self-annealing is an important feature of electroplated copper which significantly alters its microstructures. The degradation of 〈110〉 texture and the enhancement of 〈311〉 texture in electroplated copper during self-annealing process...
The room-temperature microstructural evolution of 18μm thick electroplated copper deposits was investigated by cross-sectional focused ion-beam microscopy. The fraction of transformed volume as a function of annealing time was measured. The transformation was found to start and nucleate from the bottom of the foils and then propagate towards the free surfaces. Based on differential scanning calorimetry...
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