The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Dimensional stability is critically important to various applications for which the functions are sensitive to dimensional change and internal strain. Due to the variation of densities of materials in solder, pad metal and formed IMCs, the total volume and dimensions of solder joint could varies with time of aging or service. This paper theoretically analyzed the change in volume of tin/copper solder...
Since miniaturization of electronic devices makes the joint height of solder joints shrink to tens of microns. IMCs take noticeably high volume ratio in solder joints, which seldom happens in BGA or bulk solder joints. Growth of IMCs volume ratio will definitely affect mechanical integrities of micro-scale solder joints, which is rarely covered in pervious publications. In this paper, copper/SAC305/copper...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.