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In this study, the degradation mechanism of chip resistors mounted with Ag–epoxy isotropic conductive adhesive (ICA) under two different environmental conditions, i.e., humidity exposure (85°C/85% relative humidity) and thermal cycling (TC, –40°C to 125°C), was examined by monitoring the change in electrical resistance and by transmission electron microscopy. The effect of the terminal finishes (Sn/Ni...
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