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The erosion of contact material is one of the critical failure mechanisms in switch devices. Thus it is important to study the characteristics of contact erosion. In this paper, a two-dimensional magnetic hydrodynamics (MHD) is established to get physical characteristics of the molten pool in cathode. Gas dynamics and statistical methods are then used for the calculation of the vaporization rates...
The damage introduced by low-velocity impact is a threat to adhesively bonded composite joints. The impact response and tensile behaviors after impact of composite scarf joints was investigated using experimental and finite element analysis techniques. 18 specimens were impacted in three different locations and tensile tests after impact were conducted. The test results demonstrated that when impacted...
Anisotropic thermal contraction, resin chemical shrinkage and tool-part interaction are the key parameters which induce residual stress in composite parts. For V-shaped composite parts, when released from the tool after autoclave processing, the residual stress causes deformation which acts as a decrease of the enclosed angle called spring-in. Spring-in will affect the manufacturing precision and...
The SRAP molecular marker method was used to analyze the genetic diversity of 33 materials, and the yield and quality of some materials were identified. Molecular marker analysis showed that: 42 pairs of primer combinations were used to generate a total of 715 amplification bands, of which 320 bands were polymorphic, the average polymorphic bands rate was 44.7%. The average genetic distance was 0...
TC test is very important for solder joint reliability, but the test time for TC test is very long, normally it cost about 2 months. In order to shorten TC test time, many researchers study the new test method to replace traditional TC test, such as bending fatigue test. However, there's still some limit for this field study. Considering the actual user condition, the final product not only experience...
This paper discusses the effects of chip size, PCB thickness, fixture tightness, via information on the board level drop impact performance of common IC package for hand held electronic product applications namely FBGA, when subjected to the JESD22-B111 test methodology. The experiment results reveal significant difference in the reliability performance between different via information and different...
Therepsilare many kinds of bending test conditions according to different control modes: displacement control, force control and strain control. In our paper, strain-controlled bending test was chosen, since the lifetime and failure modes were more sensitive relating to different loading strain range and strain rate. ANSYS was used to simulate the bending test to predict board level solder joint reliability...
The solder joints reliability of electronic packages during board level drop impact is a great concern for semiconductor manufacturers. Many researchers have adopted numerical simulation to investigate the drop performance of electronic package because it is fast and cost-effective. However, the solder balls, which are recognized as vital parts for the integrity of solder joints and the overall function...
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