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Board level bending testing is an effective method to evaluate the solder joint reliability of handheld products. In this work, the solder joints failure mode during cyclic bending was characterized by a board level bending test system with respect to strain range and strain rate. And then the finite element modeling and simulation was conducted to investigate the solder joints reliability by considering...
Soil nailing supporting technology is applied widely in China, soil nailing and prestressed anchor cable combined is a new composite soil nailing structure for foundation pit supporting, and there are more advantages, but many key issues require to be studied further. In present, the perfect standard of the design and the calculation and the construction control can not be determined for the supporting...
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