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Future high-power chip stacks with several hundred Watts of power dissipation rely on novel cooling topologies. In this paper, we are introducing dual-side convective cooling considering a lid-integral silicon cold plate in combination with an interposer with embedded fluid cavity. The cavity in the interposer is established by two back-to-back bonded interposer shells with integrated fluid channels...
The performance and power efficiency of high-end servers benefit from dense system integration. Accordingly, we introduce a scalable packaging platform supporting high-performance chip stacks, as a continuation in server-system density scaling.
In this study, a dual-side cooling topology based on a silicon cold plate and an electrical functional silicon-interposer with embedded fluid channels is benchmarked against mere back-side cooling. The back-side cold plate can be operated in a split-flow mode, whereas in the case of the interposer only a single in- and outlet can be implemented, which results in a cross-flow heat-exchange mode. An...
Volumetric heat removal in high-performance 3D chip stacks can be performed by means of interlayer cooling. The heat is absorbed in water, which is pumped in the liquid phase into the cavities between the active layers. Individual through-silicon vias (TSV), which maintain the electrical communication between the layers, are embedded into silicon pins in the fluid cavity. Thousands of these TSVs are...
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