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We investigate the elasto-plastic deformation properties of a 20-nm-thick copper (Cu) thin film. A nano-scale cantilever specimen is fabricated from multilayer thin films, where the Cu thin film is sandwiched between a silicon nitride layer and a silicon substrate. During bending, the load, P, and displacement, d, are carefully monitored using an electron microscope, and a distinct non-linearity is...
The plasticity of a copper nano-component is experimentally evaluated by a cantilever beam specimen in which the component is sandwiched between hard layers: silicon and silicon nitride. The cantilever is monotonically loaded with a diamond indenter so that a bending moment is applied to the Cu component, and the deflection at the free-end of the cantilever is precisely monitored by transmission electron...
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