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TSV (Through-silicon Via) meets the demands of high speed and low power consumption in 3D integrated circuits. However it faces challenge in signal integrity problem such as crosstalk. TSV to TSV coupling is the most significant crosstalk problem in TSV based 3D ICs. This paper presents a quantitative estimation on the TSV to TSV crosstalk induced interconnect delay, trying to find the worst interconnect...
In this paper, we will present a block cipher circuit design against Power Analysis. This design consists of usual masking and hiding method. For XOR, permutation and other linear layer, masking method of protection is used, but for S-box and other non-linear layer, hiding method is used in the reason that masking requires a lot of hardware consumption. We accomplished hardware implementation and...
This paper presents an electromechancial interface model of liquid floated micro-gyroscope, which can analyze sensing capacitors and resistance of gyroscope. The impacts of them are analyzed and simulated with the simulation software of circuit. The analytic results indicate that the reasonable interface circuit can substantially remove the impacts of these parasitic capacitances, increase the signal...
Fault injection in circuit level has proved to be cumbersome and time-consuming when employed to characterize the soft error sensitivity of digital circuits, hence new generation of CAD tool is required to automate the faults insertion and the validation of soft error mitigation mechanisms of the circuits. This paper outlines the characteristics of a new fault-injection platform HSECT-SPI (HIT Soft...
Soft error, a concern for space applications in the past, became a critical issue in deep sub-micron VLSI design for the continuous technology scaling. Automated fault injection technique is employed to characterize the soft error sensitivity of VHDL based design and association analysis algorithm is firstly introduced into this realm to explore the fault dependency of the components in the design...
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