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The interfacial reactions and growth kinetics of intermetallic compounds at the solder/sintered Ag metallization interface in silicon solar cells were investigated during solid-state aging. Three common solders (Sn 37 Pb, Sn 36 Pb 2 Ag, and Sn 3 Ag 0.5 Cu) were used to conduct several experiments testing the quality of the solder joints in this study. Accelerated...
It is of importance for the reliability of lead-free and lead-bearing solder joints to have better understanding and control of the solder/metallization interactions during soldering. In the reactions between solders and Cu substrate, the formation of micro voids within the Cu3Sn layer had been report by many research groups. Because the Cu3Sn growth had been linked to the formation of micro voids,...
The objective of this study is to investigate the alloying effects of Fe, Co, and Ni on the interfacial reactions between solder and Cu. Emphasis is placed on a systematic comparison study on the effect of Fe, Co, and Ni additions. Solders with simultaneous Fe and Ni addition as well as simultaneous Co and Ni addition are also prepared in order to investigate whether there is any interaction between...
We report in this work the effect of multiple reflow cycles on ball impact test (BIT) responses and fractographies obtained at an impact velocity of 500 mm/s on Sn-4Ag-0.5 Cu solder joints. Solder balls were mounted on Cu substrate pads with immersion tin surface finish, supplied by two vendors. For these particular test vehicles and test conditions, fracture near the interface between the interfacial...
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