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The microstructure of sputter deposited Ti-rich Ni-Ti thin films doped with Cu in the range 0–20.4at.% and annealed for 1h at 500 and 600°C has been investigated and correlated with the mechanical properties of the films measured by depth-sensing nanoindentation. X-ray diffraction analysis showed the microstructural evolution of Ni-Ti thin films when doped with Cu and annealed at different temperatures...
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