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To achieve ultra small form factor package solution, an ultra-thin (50µm) Si interposer utilizing through-silicon-via (TSV) technology has been developed. Challenges associated with handling thin wafer and maintaining package co-planarity have been overcome to stack thin dies (200 µm) on ultra-thin interposer. Improved electrical performance and the advantages of this innovative thin interposer are...
A combination of projects selection decision (PCSD) is the main strategy of a company. Simultaneity, the utility of project selection decision is assessed how individual project parameter dimensions are selected and to identify the combination of projects architecture dimensions that are critical for a project combine selection strategy system (PCSS). Conventional researches in project selection decision...
In this paper, the Common Land Model (CLM) and the Monteith type carbon model-C-FIX were applied to estimate the water use efficiency (WUE) of western China in 2002. The input data mainly included NCAR and Meteo France meteorological data sets, 1 km USGS soil and land cover data, the global 0.25deg monthly MODIS LAI data and the 1 km VGT-S10 NDVI products. Some field measurements of WUE for different...
A field campaign was executed in a semi-arid grassland of northwest China from July 11th-July 15th, 2002. According to the VALERI (Validation of Land European Remote Sensing Instruments) sampling procedures, the leaf area index (LAI) were intensively measured within a homogenous 3times3 km2 square by using LAI-2000 and TRAC instrument. A quarter scene of Landsat7 ETM+ with acquisition times close...
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