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3D organic packages with three-die stack were evaluated by finite element analyses and thermal cycle tests. The thermal cycle tests with different silicon thickness configurations were performed. The die-stack test vehicles with thin top die (150μm) did not show any failures during the 2000 cycles of thermal cycle tests. However, failures were detected for the test vehicles with thick top dies (400μm)...
The thermo-mechanical reliability of stacked die structures is a critical issue in 3D packaging. The assessment of the stress and the warpage of silicon dies in 3D stacked structures become important in achieving low-stress and low-warpage 3D packaging. However the parametric analyses of thermal stress and die-warpage by rigorous finite element analysis can be time consuming for 3D systems, since...
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