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A substrate integrated artificial dielectric (SIAD) structure for planar microstrip circuits miniaturization is presented. This structure is paraelectric and paramagnetic, i.e., provides enhancement of both the permittivity and the permeability from a given host substrate, and therefore achieves guided wavelength compression, leading to circuit size miniaturization. The SIAD is fully integrated and...
A novel metallic wire substrate (MWS) is proposed for miniaturized planar microwave circuits. This MWS consists of a dense array of vertical metallic wires embedded in a regular host substrate. It is demonstrated experimentally to exhibit magneto- dielectrics properties with simultaneously enhanced effective permittivity and permeability in a broad frequency range. Consequently, a substrate of higher...
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