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Polymer film is general used for stress buffer and dielectric film for Wafer Level Chip Scale Package (WLCSP). Chemical resistance and mechanical resistance of polymer films usually get worse after several processes with chemicals or heat. Weak chemical or mechanical resistance will induce polymer film cracking. Polymer cracking further induces humidity penetration into RDL (Re-distribution Layer)...
In this paper, we present a multi-agent reinforcement learning (MARL) framework that leverages the emergent behaviors from swarm intelligence (SI). The essential backbone of our framework is an flocking-regulated cooperative learning paradigm in which the cooperation among learning agents is realized via the self-organizing principles derived from natural interaction of flocking boids. In the proposed...
An analytical drain current model for a-Si:H TFTs obtained by considering deep and tail states simultaneously is presented. Using an effective temperature approach, the localised deep and tail states have been considered in the DC model such that no approximations are needed. As verified by the published data, this analytical DC model provides an accurate prediction of the drain current characteristics...
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