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This paper presents a power amplifier module (PAM) that operates efficiently in low-power mode for IEEE 802.11g Wi-Fi applications. The PAM consists of a power amplifier (PA), a buck converter, and a power detector. Two packaging technologies were used to integrate the compact module: a low-temperature co-fired ceramic (LTCC) technology and a ferrite-filled printed circuit board (PCB) technology....
In this study, a?? micro-fabricated multi-resonant capacitive switch with high isolation was successfully designed and fabricated for ultra wide band (UWB) system ranging from 3- to 10-GHz. To achieve the high isolation and wide frequency bandwidth, three capacitive shunt membranes and meander inductors were utilized to design the switch with three LC resonant switching circuits. And also, aluminum...
The impact of the forming operation current overshoot on subsequent reset current and cycling is investigated for Metal-Oxide-based RRAM through varying of metal-oxide thickness, composition, and dielectric configuration. Reducing forming voltage by means of RRAM metal-oxide stack engineering is found to lead to minimal forming current overshoot, which results in low reset currents. In addition, RRAM...
Security concerns and privacy infringement can be serious problems in many applications of radio frequency identification (RFID) systems. Most of the problems are due to the lack of user control over the communication between RFID tags and readers. Giving the user control over the RFID link can alleviate potential security problems. A simple smart card that prevents unauthorized credit card payment...
This paper reports on new concept consisting of all-oxide-based device component for future high density non-volatile data storage with stackable structure. We demonstrate a GaInZnO (GIZO) thin film transistors (TFTs) integrated with 1D (CuO/InZnO)-1R (NiO) (one diode-one resistor) structure oxide memory node element. RRAM (Resistance Random Access Memory) has provided advantages in fabrication which...
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