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In article number 2007131, Yong Soo Cho, Da Bin Kim, and Jung Won Lee propose an in‐situ strain engineering method to substantially enhance the bending fracture behavior of flexible halide perovskite films. The strain‐dependent mechanical properties with structural simulations are extensively useful for halides‐based electronic and optoelectronic devices.
Even though halide perovskite materials have been increasingly investigated as flexible devices, mechanical properties under flexible environments have rarely been reported on. Herein, a nonconventional deposition technique that can generate extra compressive or tensile stress in representative inorganic CsPbBr3 and hybrid MAPbI3 (methylammonium lead iodide) halide perovskites is proposed for higher...
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