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With the rapid scale growing of VLSI circuits, simulation speed and efficiency of CAD tool SPICE have turned out to be a bottleneck. Real VLSI circuit design simulation becomes unbearably time-consuming and urgent is the need to increase its efficiency. The emergence and thriving of multi-core systems in recent years offer a promising solution strategy to this problem. Circuit partition is required...
Technology scaling is increasingly yielding diminishing returns in terms of product performance, power, and its yield. Recent development in through-silicon via (TSV) technology has made multi-layer stacking (or 3D integration) a viable solution, opening possibility for coping with the issues related to poor interconnect scaling trend. In this direction there have been research works looking separately...
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