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A novel composition of Cu–Pd–V filler alloy was designed for the joining of C f /SiC composite. The filler alloy was fabricated into brazing foils with a thickness of 0.15mm by a rolling process. The alloy′s wettability on the C f /SiC composite was studied with the sessile drop method. After heating at 1473K for 10min the Cu–Pd–V filler alloy showed a low contact angle of 6° on the...
Au38.0–Pd28.0–Co18.0–Ni7.0–V9.0 (in wt%) alloy was designed as a filler for joining Si 3 N 4 . The filler alloy showed a contact angle of 77.2° on Si 3 N 4 ceramic at 1473K. The Si 3 N 4 /Si 3 N 4 joint brazed with the rapidly-solidified filler foils at 1443K for 10min exhibits an average three-point bend strength of 320.7MPa at room...
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