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Experimental study of growth competition between the co-existing layer-type and porous-type Cu3Sn in solder microbumps of Cu/SnAg/Cu is reported. The thickness of the SnAg solder is about 14μm and the Cu column on both sides is 20μm. Upon wetting-reflow, the solder is reacted completely to form CuSn intermetallic compounds in a multi-layered structure of Cu/Cu3Sn/Cu6Sn5/Cu3Sn/Cu. Upon further annealing...
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