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Pd-coated copper wire bonding is getting more practical applications in electronic packaging because of advantages, such as ease of use, better bonding performance and reliability. ENEPIG (Electroless Ni Electroless Pd Immersion Au) is a prevalent surface finish technique that can realize more flexible substrate design, increase wire density and hence achieve device miniaturization. Study had been...
The reliability of the MLCC embedded PCB with Cu-filled via method was investigated and the finite element method (FEM) was conducted to simulate the stress distribution in the PCB. Due to the non-symmetrical of the MLCC embedded PCB and the CTE mismatch between the materials for the embedded PCB, all samples are non-flatness after test. For the PCB tested at Pb-free reflow, no failure could be observed...
Miniaturization, high density, multi-function and low cost of electronics has brought more requirements and challenges to the substrate and package level. This, in turn, has added more functionality to the substrate compared to the printed circuit board. A substrate embedded with both the active and the passive components, is also referred to as a functional substrate. In this paper, we propose, design,...
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