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ULSI circuits are constantly improved by continuous scaling down the character sizes. Copper connections and the ultralow-k (ULK) materials as inter-layer dielectrics (ILD) and inter-metal dielectrics (IMD) were implemented. Therefore, the chip package interaction (CPI) becomes critical due to the mechanical properties deteriorate of ULK with high porosity. The reliability of ULK layer may be affected...
ULSI circuits are constantly improved by continuous scaling down the character sizes. Copper connections and the ultralow-k (ULK) materials as inter-layer dielectrics (ILD) and inter-metal dielectrics (IMD) were implemented. Therefore, the chip package interaction (CPI) becomes critical due to the mechanical properties deteriorate of ULK with high porosity. The reliability of ULK layer may be affected...
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