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A new technology using hydrogen annealing and thermal oxidation is proposed to fabricate a very compact 2-D multimode interference coupler monolithically integrated with two-layer silicon photonic wires. Two devices, a 1 × 1 cross-power coupler and a 1 × 22 power splitter, are presented and characterized. The experimental result shows that a 3-dB transmission bandwidth of 1.1 nm, and the on-chip coupler...
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