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Synchrotron radiation real-time in situ imaging technology was conducted to investigate the interfacial reaction in line-type Cu/Sn-9Zn/Cu interconnect under a current density of 1.2×104 A/cm2 at 250 °C. A reverse polarity effect, i.e., the intermetallic compound (IMC) layer at the cathode grew continuously while that at the anode was restrained, was observed in Cu/Sn-9Zn/Cu interconnects. With increasing...
The relationships between the morphology of Ag3Sn phases and the cooling rate, solder volume and 0.7 wt.% Cu addition into Sn-3.5Ag solder were investigated in this study. The morphology of Ag3Sn phases in the solder joints was greatly affected by the cooling rate. In Sn-3.5Ag/ENEPIG (electroless nickel electroless podium immersion gold) solder joints, large plate-like Ag3Sn phases formed on the interfacial...
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