The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The interfacial behaviors of Cu/molten Sn–58Bi/Cu solder joints under the coupling effect of a temperature gradient and the current stressing have been investigated. The most obvious change of the interfacial behaviors under the individual electromigration (EM) and thermomigration (TM) in molten solder was the asymmetrical growth of interfacial Cu–Sn intermetallic compounds (IMCs), which grew rapidly...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.