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Optical sensing offers unrivalled precision with real-time monitoring, but the complexity in implementing the optical sources has so far limited deployments to high value measurement systems. Innovations in photonic integration are beginning to enable breakthroughs in terms of cost, size and performance. Integrated sources and readouts can be created with large-scale semiconductor wafer production...
In this paper we introduce the III–V photonic integration platforms for emerging applications beyond telecommunications. Recent achievements in the InP generic and InP membrane platforms for wireless and sensing applications are reviewed. The realized chips show the great potential of the InP-based photonic integration due to its full functionality, high flexibility and high performance.
2-Dimensional top-coupling by employing 45o vertical mirrors based on total internal reflection is proposed. 3-spot and 6-spot InP-based spot couplers using the proposed 45o mirrors as vertical emitters are fabricated and characterized.
We present a novel photonic integrated 4×4 WDM cross-connect switch exploiting SOA technology for nanoseconds wavelength, space, and time switching operation. Experimental results show a cross-talk < −30dB, lossless and error-free operation with <1dB penalty.
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