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Wafer-Level Packaging (WLP) has emerged in modern years and played a prominent role in both semiconductor and Integrated Circuit (IC) field, as well as in Micro-ElectroMechanical Systems (MEMS) applications and fields for their distinguishing operating mechanism and adaptive design variety. In this study, numerous kinds of mature packaging technologies combined with innovation as well as integration...
A monolithic capacitance accelerometer is fabricated in 0.18μm ASIC-compatible CMOS MEMS technology and, with the assistant of universal sensing system being developed in the proposed work. The new approach combines the Dual-Chopper amplifier and Correlated Double Sampling to alleviate 1/f noise and DC offset. The total noise equivalent acceleration is 13.49ug/√Hz under 500 Hz. The tunable sensitivity...
Wafer Level Packaging (WLP) has started to shine and played a prominent role in recent years in both semiconductor and Integrated Circuit (IC) field, especially in now thriving Micro-Electro-Mechanical System (MEMS) applications on account of its distinctive operating mechanism and adaptive design variety. In this study, several crucial WLP technologies are disclosed in detail, including Wafer to...
Wafer level bonding is widely applied in the manufacture of sensors, actuators and CMOS MEMS. Bonding technology includes direct bonding, anodic bonding, eutectic bonding, adhesive bonding and glass frit bonding. Glass frit bonding has pattern-able, excellent sealing performances, high bonding strength, don't need apply any voltage during bonding process and less CTE mismatch compared to glass and...
This study establishes a batch fabricated process to implement and monolithically integrate CNTs (carbon nanotubes) based physical sensors. In this process, vertically aligned CNTs (not horizontally aligned or mixed CNTs) are grown and patterned on Si-wafer as sensing elements, and also integrated with MEMS (microelectromechanical systems) structures. The mechanical deformation and temperature change...
In recent years, miniaturization, lightening, high performance, high reliability and low cost have been demanded intensely for electronic products, especially in the rapid growth of portable cell phone domain. Furthermore, multiple functional demand induces advanced package developments, such as system-on-chip (SoC) and system-in-package (SiP). System-on-chip (SoC) is an ideal package to integrate...
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