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Rapid pressureless low temperature sintering of Ag nanoparticles for bonding is achieved. Organic shells adsorbing on the surface of Ag nanoparticles to stabilize them are thinned to be a sparse protecting layer. Numerous coherent twin boundaries formed in sintered Ag nanoparticles with a grain size of 21 nm induce ultra-high thermal conductivity (229 W/m·K), which overcomes the intrinsic defect that...
Rapid pressureless low temperature sintering of Ag nanoparticles for bonding is achieved. Organic shells adsorbing on the surface of Ag nanoparticles to stabilize them are thinned to be a sparse protecting layer. Numerous coherent twin boundaries formed in sintered Ag nanoparticles with a grain size of 21 nm induce ultra-high thermal conductivity (229 W/m·K), which overcomes the intrinsic defect that...
This paper proposed the multi head review system using the planar stage to increase the productivity about inspection in flat panel display industry. This system uses the planar stage having multi head against of conventional review system having single head gantry. Though the multi head system is able to increase productivity, it has the hazard of collision by multi head. Therefore, this paper also...
Cu/Al joints with large faying surface and high bonding ratio were fabricated with an ultrasound-assisted fluxless brazing method using a Zn-3Al near eutectic filler metal. The microstructure, tensile strength, and corrosion resistance of the joints were investigated in terms of brazing temperature. Results showed that, in the joint brazed at 440 ºC, the filler metal layer showed a refined and dispersed...
Cu-to-Cu interconnects were achieved by pressureless low temperature sintering of Ag nanoparticles for electronic packaging. Ag nanoparticles could be sintered so long as the chemical bonds by which organic shells connected with Ag nanoparticles were broken with no necessity that organic shells completely decomposed, which provided a way to lower bonding temperature. The pinecone-like recrystallization...
The intense generation of frictional heat in fast rubbing process can locally melt contacting solids and join materials. This letter decribes a localized heating and soldering at solder/Cu interface induced by ultrasonic friction. Through probing the mean surface temperature of sliding solder bump, the transient nature of frictional heat generation can be deduced, which is associated with the interfacial...
The morphologies of Cu6Sn5 grains formed at the interface between Sn-3.5Ag (wt.% unless otherwise specified) and Cu substrates were studied in this work. Reflow experiments were performed for 60 s at peak temperatures of 513 K, 533 K, 543 K, and 553 K. Two morphologies of interfacial Cu6Sn5 grains were observed after the joints solidification in air: prism type, above 543 K, and scallop type, below...
A new structural effect that was developed based on the concepts of the cantilever beams has been proposed in order to illustrate the measurement divergence of nanoindentation test for Cu6Sn5 IMCs. Cu6Sn5 IMCs were fabricated in Sn3.5Ag/Cu solder joints by wetting reaction at 250°C and subsequent thermal aging, and measured by nanoindentation. In this study, the extra displacement created by the cantilever-like...
Korea Electric Power Corporation (KEPCO) covers all power distribution lines in Korea. There are 16 districts and 189 branches around the country. To integrate and manage power distribution processes centrally, KEPCO developed the New Distribution Information System (NDIS) based on the GIS (Geographic Information System). NDIS provides efficient power distribution line management and improves resource...
Area array soldering is one of the main interconnection technologies for the inter graded circuit (IC) packaging and assembly. The typical area array soldering processes include some conventional heating methods, such as forced convective hot-air reflow and infrared reflow, which have the merit of high throughput in mass industrial production and, however, sometimes may cause the warpage of components...
Induction heating reflow method, which can achieve the solder bumping and interconnecting process in a simple way, was studied to control the height and shape of solder interconnects employed in electronic packaging application. A solder joint model was built to investigate the temperature distribution in the joint during the whole induction heating process by ANSYS software. Based on the simulation,...
In this paper, the bond interface of Al-1 wt.%Si wire bonded on Au/Ni/Cu pad at atmosphere temperature was analyzed by using high resolution transmission electron microscopy. Nano-scale characteristics at bond interface indicated that elemental aluminum diffusing into gold layer was with the feature of step-level periodicity. Due to exceeding solid solubility limit, intermediate Au8Al3 phase penetrated...
This work focuses on the nonuniform melting process and its theoretical explanation. After induction heating for 0.8 s, 1.0 s, 1.4 s and 2.0 s, different welding state can be obtained, which gives a proof of the melting process. The experiment results demonstrate that the skin effect of induction heating forms the great temperature gradient in the solder bump. The computation results give a theoretical...
Induction-self-heat-reflow technology (ISHR), which has the advantages of 3-D selective heating and high heating speed, can solve the problems which can't be controlled in traditional reflow technologies, such as inhomogeneous heating of ball grid array (different bumps), simultaneous heating of chip and carrier with solder ball, etc., which have been increasingly serious with the development of packaging...
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